一种单组份胶黏剂及其制备方法

One-component adhesive and preparation method thereof

Abstract

本发明提供了一种单组份胶黏剂及其制备方法,该胶黏剂包括环氧树脂、潜伏性固化剂、无机粉末和促进剂,所述环氧树脂包括液态环氧树脂和低粘度改性环氧树脂;所述无机粉末包括含铝无机粉末;所述促进剂包括改性镍盐类络合物促进剂。流动性好、能低温储存且耐高温,耐高温温度能达到300℃,同时固化速度快。
The invention provides a one-component adhesive and a preparation method thereof. The adhesive comprises epoxy resin, a latent curing agent, inorganic powder and an accelerant, wherein the epoxy resin comprises liquid epoxy resin and low-viscosity modified epoxy resin; the inorganic powder comprises aluminum-containing inorganic powder; and the accelerant comprises a modified nickel salt complex accelerant. The one-component adhesive is good in liquidity, can be stored at low temperature, and can be high-temperature resistant; the heat-resistant temperature can reach 300 DEG C; and meanwhile, the curing speed is high.

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Patent Citations (2)

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Cited By (2)

    Publication numberPublication dateAssigneeTitle
    CN-105968714-ASeptember 28, 2016重庆市锦艺硅材料开发有限公司苏州分公司Resin composition and copper-clad plate produced by resin composition
    CN-105968714-BJanuary 16, 2018重庆市锦艺硅材料开发有限公司苏州分公司一种树脂组合物及其制作的覆铜板